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Can BGA Chips Be Removed with a Soldering Iron?

Ball Grid Array (BGA) components are commonly found in modern electronics due to their high pin count and compact design. Unlike through-hole or standard surface-mount devices, the solder balls of BGAs are located underneath the component, making removal and replacement a delicate task. A common question among electronics hobbyists and technicians is whether a soldering iron alone can be used to remove BGA chips.

BGA components have multiple tiny solder balls arranged in a grid beneath the chip. These solder balls are not visible from above, which means:

  • Applying heat with a standard soldering iron only touches the top of the chip, not the solder balls.
  • Uneven heating can damage the PCB, lift pads, or warp the component.
  • Precise temperature and airflow control are required to safely melt the solder without harming surrounding parts.

Using a traditional soldering iron for BGA removal is generally not recommended:

  • Limited Heat Coverage: The soldering iron tip cannot reach all the solder balls evenly.
  • High Risk of Damage: Localized heat may lift pads, crack the PCB, or damage nearby components.
  • Time-Consuming: Removing a BGA with a soldering iron alone is inefficient and may result in poor solder joints.

1. Hot Air Rework Station

  • Directs a controlled flow of heated air to evenly melt all solder balls simultaneously.
  • Minimizes thermal stress on the PCB and surrounding components.
  • Allows safe removal using tweezers or a vacuum pick-up tool.
GORDAK 850B Hot Air SMD Rework Station

2. Infrared Reflow Station

  • Provides uniform heating from multiple directions.
  • Ideal for sensitive boards that cannot tolerate uneven heat.

3. Preheating the PCB

  • Gradually heating the board reduces thermal shock and makes BGA removal safer.
  • Often used in combination with hot air or infrared stations.
  • Always use flux to improve solder flow and prevent oxidation.
  • Work in a clean, ESD-safe environment to protect components.
  • Use magnification tools or microscopes to monitor the solder joints.
  • Practice on scrap boards to build skill before working on critical components.

While it is technically possible to attempt BGA removal with a soldering iron, the risk of damaging the PCB or the component is very high. For reliable and safe BGA rework, using a hot air or infrared rework station is strongly recommended. These tools ensure even heating, precise control, and higher success rates for removing and replacing BGA chips.

Gordak is a leading manufacturer of soldering and rework equipment, providing high-quality, reliable, and innovative tools for electronics professionals worldwide. With over 30 years of industry experience, Gordak combines advanced technology, precise temperature control, and ESD-safe designs to meet the needs of SMD and through-hole soldering applications. Committed to excellence, Gordak offers affordable solutions, responsive customer support, and products trusted by clients across the globe.

info@gordakelec.com

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