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使用热风返修站时防止损坏 PCB 的技巧

Hot air rework stations are essential tools for soldering and desoldering surface-mounted components on printed circuit boards (PCBs). While highly effective, improper use can lead to PCB damage such as lifted pads, delamination, or thermal stress. At 戈尔达克电气公司, we are committed not only to providing high-quality rework equipment—but also to educating users on best practices to ensure successful, damage-free operations.

Whether you are using the Gordak 850 series, 857D, or advanced 958D, the following tips will help you prevent PCB damage while using a hot air rework station.

GORDAK-850-Rework-Station

One of the most common causes of PCB damage is overheating. Excessive heat can burn the board, lift pads, or cause warping.

  • For most SMD desoldering tasks, set your Gordak station to 280°C–350°C
  • Avoid using the maximum temperature unless absolutely necessary
  • Monitor the heat with a thermometer or thermocouple for critical applications

High airflow can blow off nearby components or overheat adjacent areas. Low airflow may result in uneven heating.

  • Start with medium airflow and adjust as needed
  • On models like Gordak 958D, use the digital control to fine-tune the air volume
  • Use a smaller nozzle for concentrated heating when working in tight spaces

For multilayer or thick PCBs, preheating the board helps reduce thermal shock and ensures more uniform solder melting.

  • 使用 preheating plate or infrared heater below the PCB
  • Gradually raise the temperature before applying hot air directly

Maintaining the correct distance from the board is critical. Placing the nozzle too close can overheat the board, while too far may lead to ineffective soldering.

  • Keep the hot air nozzle 2-4 厘米 above the PCB
  • Move the nozzle in small, circular motions to distribute heat evenly

Selecting the appropriate nozzle based on component size will help focus the heat and prevent adjacent parts from heating unnecessarily.

  • Gordak stations are compatible with a variety of nozzle sizes
  • For ICs, use square or rectangular nozzles that match the package shape
  • For smaller resistors and capacitors, use fine-point nozzles

Flux improves solder flow and heat transfer, which reduces the need for prolonged heating.

  • 申请 no-clean or rosin flux around the component before applying heat
  • It also helps prevent oxidation during the process

Prolonged exposure to high heat is a major risk for PCB layers, solder pads, and internal vias.

  • Most small components should take 5–10 seconds of heat for removal
  • If the component doesn’t move, stop and reassess—do not force it

Static electricity can cause invisible damage to ICs and delicate components.

  • Work on an ESD mat with a grounded wrist strap
  • 使用 ESD-safe tweezers and vacuum tools

Sudden cooling can stress the board material and solder joints.

  • Allow the board to cool naturally after the operation
  • Do not blow air directly on the PCB to cool it faster

After rework, inspect the solder joints and cleaned area carefully:

  • 使用 异丙醇 and lint-free cloth to remove any flux residue
  • Check for lifted pads, solder bridges, or component misalignment
GORDAK 958A Rework Station

戈尔达克电气公司, we design our hot air rework stations—including models such as 850, 850A, 850B, 857, 857D, 958, 958A, and 958D—to deliver stable temperature control, adjustable airflow, and safe, precise performance for a wide range of PCB repair tasks.

Whether you’re working in a repair center, factory, or training lab, our tools support you in achieving professional results while minimizing the risk of PCB damage. Each model features intelligent cooling, compact design, and compatibility with various nozzles to suit different applications.

For product recommendations, technical support, or OEM/ODM cooperation, feel free to reach out to us.

电子邮件: info@gordakelec.com

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