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不同焊接应用的温度指南

Proper temperature control is one of the most important factors in successful soldering. Using the correct temperature ensures strong solder joints, prevents component damage, and reduces the risk of cold or burnt connections. This guide provides temperature guidelines for various soldering applications, from through-hole electronics to delicate surface-mount devices (SMDs).

1. General Electronics Soldering

  • Through-Hole Components: 300–350°C
  • Purpose: Standard resistors, capacitors, microcontrollers, and other through-hole components.
  • 小贴士 Use a fine or chisel tip for precision and clean heat transfer.

2. SMD Component Soldering

  • Small SMDs (0603, 0805, etc.): 320–350°C
  • ICs (QFP, PLCC): 330–370°C
  • BGA Chips: 350–380°C (preferably with hot air or rework station)
  • 小贴士 Apply flux generously to improve solder flow and reduce the risk of cold joints.

3. Lead-Free Soldering

  • Melting Point of Lead-Free Solder: 217–227°C
  • Recommended Soldering Temperature: 350–370°C
  • 小贴士 Lead-free solder requires slightly higher heat than leaded solder. Avoid excessive heat to prevent PCB damage.

4. Rework and Repair Applications

  • Component Removal with Hot Air: 300–380°C depending on component type and size
  • Solder Paste Reflow: 230–250°C for lead-free, 180–200°C for leaded solder
  • 小贴士 Gradually heat the board to avoid warping or lifting pads.

5. Specialty Applications

  • Copper Wire Soldering: 350–400°C depending on wire gauge and insulation type
  • Jewelry or Metalwork: 400–450°C depending on metal type
  • 小贴士 Use appropriate solder and flux to ensure proper bonding.

Best Practices for Temperature Control

  1. Always Preheat Sensitive Boards: Reduces thermal shock and protects components.
  2. Use a Temperature-Controlled Soldering Station: Maintains consistent heat for precise soldering.
  3. Monitor Tip Condition: Clean and tin your soldering tip regularly to ensure efficient heat transfer.
  4. Avoid Excessive Heat: Prolonged high temperatures can damage the PCB and components.
  5. Use Flux Appropriately: Helps solder flow at lower temperatures and improves joint quality.

关于 GORDAK

Gordak 是领先的焊接和返修设备制造商,为全球电子专业人士提供优质、可靠和创新的工具。凭借 30 多年的行业经验,Gordak 将先进技术、精确温度控制和 ESD 安全设计相结合,满足 SMD 和通孔焊接应用的需求。Gordak 致力于追求卓越,提供经济实惠的解决方案、快速响应的客户支持以及深受全球客户信赖的产品。

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