Modern smartphones are built with compact, high-density circuit boards that integrate multiple surface-mounted components (SMDs), including chips, connectors, and micro-resistors. When these components fail, a reliable rework solution is required—one that offers precision, control, and safety.
A 热风返修站 is an essential tool for mobile phone repairs at the board level. Whether replacing a charging IC, removing a faulty capacitor, or reballing a BGA chip, hot air technology allows technicians to desolder and resolder components accurately without damaging the PCB.
Why Use a Hot Air Rework Station for Mobile Repairs?
Mobile phones require non-contact, evenly distributed heat when repairing SMDs on delicate logic boards. A hot air rework station provides:
- 精确的温度控制 to avoid overheating nearby components
- Adjustable airflow to prevent small components from shifting or blowing away
- Interchangeable nozzles to focus heat on targeted areas
- Fast heating and cooling for efficient repair workflows
在 戈尔达克电气公司, our rework stations are engineered with these features in mind, ensuring reliable results for professional mobile phone repair technicians.
Common Mobile Phone Repair Tasks Using Hot Air
1. IC Chip Removal and Replacement
Hot air is used to safely heat solder joints underneath integrated circuits. With controlled airflow and a proper nozzle, the IC can be lifted cleanly without applying physical force.
2. Connector Repair (Charging Ports, FPCs)
Small flex and board-to-board connectors are vulnerable to damage. Hot air allows desoldering and reinstallation with minimal PCB stress.
3. BGA Reballing and Rework
For high-end repairs such as reballing CPUs, GPUs, or NAND chips, hot air stations are used to uniformly reflow solder balls before reattachment.
4. Component-Level Diagnostics
Technicians often use hot air in combination with a microscope and multimeter to isolate and replace tiny resistors, capacitors, or filters that fail due to heat, impact, or corrosion.
Best Practices for Mobile Phone Rework
- Use fine nozzles to concentrate heat on specific components
- 应用助焊剂 to improve solder flow and prevent oxidation
- Preheat multilayer PCBs to reduce thermal shock
- Keep nozzle distance at 2–3 cm and move in slow circles for even heating
- Avoid excessive airflow to prevent displacement of neighboring parts
- Cool gradually to avoid stress on solder joints or board materials
Recommended Station Features for Mobile Repair
- Digital temperature control with real-time display
- Adjustable airflow suited for small SMDs
- Compact handle and replaceable nozzles for working in tight board spaces
- Intelligent cooling system to prolong heater and fan lifespan
- Lightweight, ESD-safe design to protect sensitive phone components
Why Technicians Trust Gordak Electric
With years of industry experience, 戈尔达克电气公司 provides hot air rework stations designed for the demands of smartphone repair. Whether you’re working on iPhone logic boards, Android mainboards, or compact SMD repairs, our stations offer stable, accurate heating, durable construction, and easy maintenance.
All Gordak models are built for precision, safety, and efficiency—making them the ideal choice for professional repair shops, training centers, and OEM service providers.
For product recommendations, OEM/ODM cooperation, or technical support, please contact us:
电子邮件： info@gordakelec.com
